UCT Specialties chemicals, 3 diverse uses

UCT manufactures an extensive line of silanes, fluid and reactive silicones, homogeneous platinum catalysts and inhibitors for a wide variety of applications. This month we will highlight three diverse areas for these materials by citing recent patents and patent applications. In US Patent 7,953,311, Julian Mullany et al describes the use of a silicone gel sealant for fiber optic communications cable enclosure assemblies. Here is an excerpt from the patent; “Because curing is generally involved in the preparation of these gels, they are sometimes referred to as thermosetting gels. The gel may be a silicone gel produced from a mixture of divinyl terminated polydimethylsiloxane, tetrakis (dimethylsiloxy)silane, a platinum divinyltetramethyldisiloxane complex, commercially available from UCT, Inc. of Bristol, Pa., polydimethylsiloxane, and 1,3,5,7-tetravinyltetra-methylcyclotetrasiloxane (reaction inhibitor for providing adequate pot life).” Please note that we also offer PS200, a silane based coating, for optical fibers that provides lubricity and reduces breakage during fabrication and subsequent flexing. Thomas Whitesides et al, US Patent Application 20110284808, describes the use of a polymerizable silane, 3-(N-styrylmethyl-2- aminoethylamino) propyltrimethoxysilane, (S1590) in preparing particles for use in electrophoretic displays. S1590 is used to functionalize the surface of a pigment by forming a covalent bond with the pigment, through the hydrolyzable trimethoxy groups thereby adding a styrenic double bond to its surface. This double bond is then free to undergo free radical polymerization with other materials, like acrylates and methacrylates, to form grafted structures. Silicones are often used to fabricate microfluidic devices. In US Patent Application 20120003755 Stephen Chapin et al describes techniques for high precision scanning of hydrogel microparticles. The microfluidic apparatus is fabricated on a silicon wafer using soft lithography and addition cured polydimethylsiloxanes. Master molds were prepared by spin-coating with a negative photoresist and developed using standard procedures. The wafers were then treated with T2492, (tridecafluoro-1,1,2,2-tetrahydrooctyl)-1-trichlorosilane, to impart a teflon-like surface to the uncoated areas to facilitate further fabrication of the device.